One component adhesive/sealant
Cures at room temperature when exposed to moisture in the air.
Alkoxy cure system,
Non-sag, paste consistency
Thermal conductivity: 0.8W/m·k
■ RoHs Compliance: Yes
Sealing lids and housings
General sealing and component protection
Bonding hybrids or microprocessors to sinks
All surfaces must be clean and dry. Degrease and wash off any contaminants that could impair adhesion. Suitable solvents include isopropyl alcohol, acetone or methyl ethyl ketone. Good unprimed adhesion may be obtained on a variety of substrates, including enameled and painted steel, aluminum, ceramics, glass and certain plastics. Substrates to which good adhesion is normally not obtained include PTFE, PE, PP and related materials. Apply a bead of BN-RT200 H Adhesive/ Sealant to one of the prepared surface, and then quickly cover with the substrate to be bonded. Very deep sections, will take longer to cure completely.
■ Cure time
After skin formation， cure continues inward from the surface. Cure time is extended at lower humidity levels. Before handling and packaging bonded components, users are advised to wait a sufficiently long time to ensure that the integrity of the adhesive seal is not affected. This will depend on many factors and should be determined by the user for each specific application.
100g/blister, 300ml cartridge.
■ Usable life and storage
BN-RT200 H has a shelf life of 12 months from the date of manufacture when stored at or below 30℃ in the original un opened containers.