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BN-FS300

  • Features and Benefits

       Thermal conductivity: 3.0 W/m·K
       Excellent thermal performance
       Electrical insulating characteristics
       Low oil-bleeding
       High tack surface reduces contact resistance
       Available in die-cut parts and sheets
       Available with reinforcement carrier or non-reinforced one
       Self-adhesive

     

    Bornsun's Thermal Pad (Gap pad)
       Bornsun has been engaging in TIM material for more than 18 years. As a leading manufacturer, we continually develop and manufacture gap-pad to meet demands of clients. We're the only one manufacturer which is able to produce 8W/m·k conductivity gap-pad in China.
       BN-FS300 thermal pads, which are made from soft silicone conductive materials, have excellent thermal and electrical insulating performance.
       BN-FS300 thermal pad is soft and flexible which could reduce contact resistance between heat generators and heat sinks, transferring heat to heat spreaders effectively.

     

     Application
       Between an IC and a heat sink
       Between a semiconductor and heat sink
       Between power supply module and heat spreader
       Between heat-generating devices and chassis
       Hard drive cooling
       Signal amplifier cooling
       CD-ROM/DVD cooling
       LEDs, lighting
     

     

    Remark:Data above, which is based on lab experiments, is reliable. However, the information given here shall in no event be regarded as a guarantee of conditions or characteristics. Tests must be done to make sure that the product is suitable for your uses. For further information on technology, delivery terms and conditions and prices, please feel free to contact us. We will always do our best to help you.