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BN-FS250

  • Features and Benefits
     Thermal conductivity: 2.5 W/m·K
     Excellent thermal performance
     Electrical insulating characteristics
     Low oil-bleeding
     High tack surface reduces contact resistance
     Available in die-cut parts and sheets
     Available with reinforcement carrier or non-reinforced one
     Self-adhesive

    Bornsun's Thermal Pad (Gap pad)
    Bornsun has been engaging in TIM material for more than 18 years. As a leading manufacturer, we continually develop and manufacture gap-pad to meet demands of clients. We're the only one manufacturer which is able to produce 8W/m·k conductivity gap-pad in China.

    BN-FS250 thermal pads, which are made from soft silicone conductive materials, have excellent thermal and electrical insulating performance.

    BN-FS250 thermal pad is soft and flexible which could reduce contact resistance between heat generators and heat sinks, transferring heat to heat spreaders effectively.
    Application
     Between an IC and a heat sink
     Between a semiconductor and heat sink
     Between power supply module and heat spreader
     Between heat-generating devices and chassis
     Hard drive cooling
     Signal amplifier cooling
     CD-ROM/DVD cooling
     LEDs, lighting

     

     

    Remark:Data above, which is based on lab experiments, is reliable. However, the information given here shall in no event be regarded as a guarantee of conditions or characteristics. Tests must be done to make sure that the product is suitable for your uses. For further information on technology, delivery terms and conditions and prices, please feel free to contact us. We will always do our best to help you.